2022-11-15
Recently, Shenzhen Xinyuan New Materials announced that it has completed tens of millions of Pre-A round of financing. This round of financing was jointly led by Noyan Capital and Yuanhe Puhua, and followed by old shareholder Zhongnan Venture Capital.
Roger Zhuang managing partner of Nuoyan Capital, said: "With the gradual increase in the application of 3.5G in new energy vehicles, photovoltaics, radio frequency, consumer electronics and other fields, packaging materials that can serve in high temperature and high power density environments play a vital role in the life and reliability of devices. As a potential leader in my country's sintered silver field, Xinyuan New Materials will vigorously promote the process of domestic substitution in the core links of the semiconductor industry chain, and form an industrial cluster of devices, modules and packaging with several invested companies of Nuoyan Capital to exert synergy. Nuoyan Capital will further deepen the concept of industrial investment and help Xinyuan New Materials and other invested companies to move to a higher level."
Recently, 36Kr learned that Shenzhen Xinyuan New Materials Co., Ltd. (hereinafter referred to as "Xinyuan New Materials") received tens of millions of Pre-A round financing jointly led by Nuoyan Capital and Yuanhe Puhua, and followed by angel round investor Zhongnan Venture Capital Fund. It is reported that this round of financing will be mainly used for new product research and development, production line expansion and market development.
Xinyuan New Materials was established in April 2022 and is located in Bao'an District, Shenzhen City, Guangdong Province. It focuses on the research and development, production, sales and technical services of high-end semiconductor packaging materials represented by sintered silver products, and provides high heat dissipation and high reliability solutions for power semiconductor packaging and advanced integrated circuit packaging. The product technology originated from the basic scientific research of nanosilver sintering by the founding team during their doctoral studies. Based on silver sintering technology, a material research and development platform was built to achieve the incubation of various material products.
Semiconductor packaging materials play a role in signal transmission, heat diffusion, and mechanical support in power electronic devices, and have a decisive influence on the service capability and reliability life of semiconductor devices. With the increase in power density and service temperature of semiconductor devices, packaging materials such as low-temperature solder and conductive adhesive can no longer meet the needs of reliable connection.
Hu Bo, founder and CEO of Xinyuan New Materials, told 36Kr that sintered silver materials have the characteristics of good heat dissipation and high reliability, but due to the high price and limited application scenarios, the entire industrial application and academic research were relatively sluggish in the early years. In recent years, with the development of high-power density third-generation semiconductors, advanced RF and optical communications, multi-layer stacked chiplets and other products, sintered silver materials have also begun to gain widespread attention and have been gradually applied to new energy vehicles, photovoltaic inverters, mobile phone fast charging, RF communications and other fields, with great market prospects. Taking new energy vehicles as an example, sintered silver materials have become an indispensable part of SiC device packaging.
When the size of silver particles is reduced to nanometer size, the specific surface area of the particles increases, and the migration activity of surface atoms is enhanced, so that the silver particles can be sintered and metallurgically bonded at a temperature far below the melting point. In addition, sintered silver has excellent electrical, thermal and mechanical properties, and has great potential in semiconductor packaging.
Xinyuan New Materials has successively overcome key technical bottlenecks such as batch nanosilver preparation technology, flux-free green organic carrier synthesis process and micro-nano structure design. Through secondary industrial design and composite material structure design of production equipment, it has formed a diversified product line with sintered silver characteristic process as the core.
At present, Xinyuan New Materials has launched three series of products. The first category is sintered silver materials for automotive applications, including pastes, prefabricated films, electrode sheets and other forms. The second category of products is high thermal conductivity silver glue materials, which can be used in RF communications, optoelectronic sensing and other scenarios, and the thermal conductivity test can reach more than 100W/mK. The third category of products is nano-metal bonding materials, which can be used in the pan-semiconductor field. Related products have been recognized by many customers, and some products have been mass-produced and supplied.
In the founding team, Hu Bo, founder and CEO of Xinyuan New Materials, has been researching the field of materials for more than 15 years. He received his doctorate from Harbin Institute of Technology and has done a lot of research on sintered silver, conductive adhesives and other materials. Currently, Xinyuan New Materials has more than 20 employees.
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